Fast Curing Structural Epoxy Adhesive
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Payment
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Origin
China Mainland
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Minimum Order
15
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Packing
Pieces
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- Description
Product Detail
If you are planning to wholesale best cheap and high quality fast curing structural epoxy adhesive China, or hot sale fast curing structural epoxy adhesive in China from professional fast curing structural epoxy adhesive manufacturers and suppliers and factory, please feel free to contact SEPNA, and welcome to check products price with us.
High Tensile Fast Curing Epoxy Adhesive SE2211
?Detailed Product Description
SE2211 is epoxy adhesive with high tensile and high curing speed
Features
1.Resistance of moisture, pollution and other atmospheric constituent
2.High tensile, excellent adhesive property
3.Excellent pollution resistance, the demand of preprocess is low
4.No solvent, no curing by-products
5.Wonderful anti-temperature (-50?~150?)
6.Excellent adhesive performance with fiberglass and metal sheet
7.Have passed the UL certification
Use
For SMC FRP bonding, aluminum honeycomb pane splicing, transformer motor core bonding, Nomex paper bonding etc.
?Data Table
Properties before curin | ||
Part | A | B |
Appearance | Black thick paste | Off-white thick paste |
Density, g/cm3(25?) | 1.35 | 1.35 |
Mixture/mass ratio, weight | 100:100 | |
Mixture/mass ratio, volume | 100:100 | |
Viscosity after mixing, mPa.s (25?) | Thixotropy | |
Density after mixing, g/cm3(25?) | 1.35 | |
Operation time after mixing, min(25?) | 10 | |
Preliminary curing time,?/min | 60/20 or 25/70 | |
Properties after curing | ||
Hardness, Shore D | 90 | |
Tensile-shear strength Mpa ,Al/Al | 17 | |
Heat conductivity, W/mK | 0.4 | |
Expansion parameterµm/(m,?) | 44 | |
Water absorption 24h,25?,% | <0.3 | |
Dielectric strength, KV/mm,25? | >20 | |
Loss factor(1 MHz) | 0.014 | |
Dielectric constant (1 MHz) | 3.53 | |
Volume resistance DC500V, O·cm | 1.2×1015 |
Note:
?All data above were tested under standardized condition.
?All data listed in the chart were for the generalized item in the series; please refer to the related data sheet for special items.
?Storage condition has a direct impact to the products’ shelf life, Please refer to the instruction for special items’ storing
?Operation
1. Buckets of A and B material is recommended to be stirred before using the components of A/B , A, B should be paid attention to seal preservation after using .
2.Stirring should pay attention to the same direction, otherwise there will be mixed with too many air bubbles; Container frame and bottom of the rubber should also stir evenly, otherwise there will be a local not curing phenomenon caused by the mixing inequality
3.The temperature is too low will cause the curing speed slow, when unable to reach initial strength , constant temperature control required on site.
4.Cartridge packaging use midway need to keep the material mouth sealed.
5.This curing process of adhesive is exothermic reaction , the adhesive quantity will affect the duration of operation, thus the operating time with 100 g adhesive is only a reference time.
?Package and Storage
Package Storage
Part A : 20kg/bucket , 310ml/cartridge Seal and Avoid light and light
Part B: 20kg/bucket or 310ml/cartridge Temperature=25?, humidity=50%RH
Customized packaging Shelf life: Part A 12months, Part B 12 months
?Safety Operation Material
MSDS isn't included here. Please read TDS, MSDS and label carefully before operation.You can get MSDS from Sepuna or other distributors, or mail to service center sepuna@sepuna.cn, or call +86-400-882-1323.
?Product Warranty
All product properties and application details based on information believe to be reliable and accurate. But you still need to test its property and safety before application. The advices we supply don't apply in any circumstances. Sepuna don't make assurance of any other applications outside the specification until Sepuna supply a special written guarantee. Sepuna is only responsible to replace or refund if this product is defective within the warranty period stated above. Sepuna makes it clear that will not be liable of any accidents.
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